Method and apparatus for monitoring a corrosive environment for electrical equipment

ABSTRACT

An apparatus includes a first printed circuit board (PCB), the first PCB including a first interface, and a corrosion sensor assembly. The corrosion sensor assembly including a second interface arranged to be coupled to the first interface. The corrosion sensor assembly further including a signal trace field and a plurality of components, where the signal trace field and the plurality of components are arranged to provide an indication of whether the apparatus is in an environment that is corrosive.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a divisional of U.S. patent application Ser.No. 16/941,300 entitled “METHOD AND APPARATUS FOR MONITORING A CORROSIVEENVIRONMENT FOR ELECTRICAL EQUIPMENT”, filed on Jul. 28, 2020, which isa divisional of U.S. patent application Ser. No. 15/230,031 entitled“METHOD AND APPARATUS FOR MONITORING A CORROSIVE ENVIRONMENT FORELECTRICAL EQUIPMENT”, filed on Aug. 5, 2016 (now U.S. Pat. No.10,761,010). The contents of these applications are incorporated hereinby reference in their entireties.

TECHNICAL FIELD

The disclosure relates generally to monitoring environments in whichelectrical equipment is used or otherwise placed. More particularly, thedisclosure relates to a sensor assembly which allows the environment, inwhich electrical equipment is located, to be monitored determining thepresence and/or the severity of a corrosive environment.

BACKGROUND

The environment in which network and telecommunications equipment or,more generally, electrical equipment, is often not conducive to theprolonged operation and life of the equipment. For example, theequipment may be subjected to adverse environmental factors throughoutits lifetime. Such adverse environmental factors may include, but arenot limited to including, temperature and humidity extremes, airborneparticulates, chemical pollutants, and other contaminants.

Adverse environmental factors may lead to equipment performancedegradation and a shortened useful life. Metallic corrosion, which isgenerally an electrochemical reaction that occurs when metals areexposed to electrolytes, may destroy metal over time. An electrolyte maybe moisture, as well as other environmental elements. Metallic corrosionmay occur in electrical equipment that includes a printed circuit board(PCB). In PCBs, metallic corrosion may cause the destruction of coppertraces and, thus, cause degraded and unstable performance of the PCBs.Further, metallic corrosion may reduce the life expectancy of circuitsincluded on the PCBs.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings in which:

FIG. 1 is a diagrammatic representation of a printed circuit board (PCB)assembly that includes a corrosion sensor assembly in accordance with anembodiment.

FIG. 2 is a diagrammatic representation of a PCB assembly that includesa pluggable corrosion sensor assembly in accordance with an embodiment.

FIG. 3A is a diagrammatic representation of a pluggable corrosion sensorassembly in accordance with an embodiment.

FIG. 3B is a diagrammatic representation of a pluggable corrosion sensorassembly of a first shape in accordance with an embodiment.

FIG. 4 is a diagrammatic representation of a PCB assembly that includesa pluggable corrosion sensor assembly of a first shape in accordancewith an embodiment.

FIG. 5 is a process flow diagram which illustrates one method of using apluggable corrosion sensor assembly in accordance with an embodiment.

FIG. 6 is a diagrammatic representation of an overall system thatincludes a corrosion sensor assembly and a computing system configuredto process data obtained by the corrosion sensor assembly in accordancewith an embodiment.

DESCRIPTION OF EXAMPLE EMBODIMENTS General Overview

In one embodiment, an apparatus includes a first printed circuit board(PCB), the first PCB including a first interface, and a corrosion sensorassembly. The corrosion sensor assembly including a second interfacearranged to be coupled to the first interface, the corrosion sensorassembly further including a signal trace field and a plurality ofcomponents, wherein the signal trace field and the plurality ofcomponents are arranged to provide an indication of whether theapparatus is in an environment that is corrosive, or the potential riskthat the apparatus is in due to an environment that is corrosive.

Description

Adverse environmental factors may lead to equipment performancedegradation and a shortened useful life. Exposure of printed circuitboards (PCBs) in electrical equipment to corrosive environmental factorssuch as moisture may cause components of the PCBs, e.g., copper traces,to corrode over time. Metallic corrosion occurs when metals are exposedto electrolytes, e.g., moisture, and when a copper trace is exposed toelectrolytes, the performance of the copper trace may degrade and becomeunstable, thereby reduce the life expectancy of a circuit that includethe copper trace.

Corrosion typically occurs relatively slowly. That is, corrosion isoften a slow-acting process. Often, the performance degradationassociated with a trace on a PCB that is subjected to corrosion willinitially be substantially imperceptible, and therefore, corrosion maybe difficult to detect and to diagnose. However, if corrosion is notaddressed and potentially remediated, corrosion may progress to a pointat which a PCB effectively becomes unusable. The worsening of PCBperformance, or the worsening of the performance of a circuit on a PCB,may render the PCB to be unusable, and often leads to the failure of thePCB altogether.

In one embodiment, a sensitive and relatively precise method monitors anenvironment to determine whether equipment, e.g., electrical equipment,is subjected to a corrosive environment and/or to what extent theequipment is subject to the corrosive environment. By positioning asensor assembly which is configured to detect changes to a sensor PCBwhich may indicate that traces of the sensor PCB are likely corroding onthe sensor PCB, the ability to determine when equipment that includesthe sensor PCB is subjected to a corrosive environment may be enhanced.For example, a system operator may track the growth rate of corrosion ona sensor PCB, and intervene as needed. When a system operator has theability to detect corrosion in equipment when corrosion is justbeginning, environmental factors which may be causing the corrosion maybe addressed, and remediating actions may be taken. Remediating actionsmay include, but are not limited to including, removing the affectedequipment from the corrosive environment or replacing the affectedequipment prior to degraded performance of the equipment occurringand/or causing issues.

A sensor assembly, e.g., a corrosion sensor assembly, may be arranged tobe included on a PCB in equipment that is placed in a potentiallycorrosive environment. Through the use of an onboard processor, sensorchanges on the corrosion sensor assembly may be logged, filtered,analyzed, and paired to management software to trigger alarms, as wellas to effectively predict system corrosion effects. Such corrosionsensor assemblies may be networked, and data acquired by such corrosionsensor assemblies may be used to enable multi-variable data analytictrends and predictions. As such, corrosion sensor assemblies may be usedto ascertain whether a PCB on which the corrosion sensor assembly ismounted is subjected to a corrosive environment.

Referring initially to FIG. 1, a PCB assembly which includes a corrosionsensor assembly will be described in accordance with an embodiment. APCB assembly 100 includes a PCB 104 that includes at least one component108. Components 108 may generally include, but are not limited toincluding, electrical components such as resistors and capacitors,mechanical components such as connectors, integrated circuits (ICs),traces, and the like.

PCB assembly 100 also includes a corrosion sensor assembly 112 that isin communication with PCB 104, e.g., physically mounted on PCB 104 andin electrical communication with PCB 104. It should be appreciated thatcorrosion sensor assembly 112 may be physically coupled to PCB assembly110 through any suitable coupling interface, as for example a solderjoint, epoxy, or the like. Corrosion sensor assembly 112, which will bedescribed in more detail below with respect to FIG. 3A, generallyincludes a PCB, a signal trace field, and electrical components whichare configured to indicate when corrosion sensor assembly 112 or, moregenerally, PCB assembly 100, is located in a potentially corrosiveenvironment.

In one embodiment, a corrosion sensor assembly may be pluggable. Thatis, a corrosion sensor assembly may be arranged to be readily removed ordecoupled from a PCB such that it may efficiently be replaced. FIG. 2 isa diagrammatic representation of a PCB assembly that includes apluggable corrosion sensor assembly in accordance with an embodiment. APCB assembly 200 includes a PCB 204 on which components 208 are mounted,and a pluggable corrosion sensor assembly 212. PCB 204 also includes areceptacle 216 with which pluggable corrosion sensor assembly 212 may becoupled, e.g., mounted, or otherwise electro-mechanically coupled.Through the use of receptacle 216, pluggable corrosion sensor assembly212 may effectively be coupled with, and uncoupled from, PCB 204.

With reference to FIGS. 3A and 3B, a pluggable corrosion sensor assemblywill be described in accordance with an embodiment. FIG. 3A is a blockdiagram representation of a corrosion sensor assembly in accordance withan embodiment. A corrosion sensor assembly 312 includes a sensor PCB 330that includes multiple openings or slots 334 and traces 338, e.g.,copper traces. Openings 334 are arranged substantially around traces 338to allow air to flow through and around traces 334 or, more generally, afield of traces 338. As will be appreciated by those skilled in the art,openings 334 are generally holes or aperture defined within PCB 330.

The field of traces 338 may include any number of traces 338 thateffectively span the width of sensor PCB 330. In one embodiment, fieldof traces 338 includes approximately four traces 338 that areapproximately 25 millimeters (mm) in width. Of the four traces 338, twotraces 338 may be formed from exposed copper to effectively mimic atypical PCB signal trace configuration, while two traces 338 may besubstantially potted to shield those two traces 338 from moisture andother environmental contaminants. In other words, a pair of traces 338is substantially exposed to the environment, while another pair oftraces 338 is substantially shielded from the environment. As will beappreciated by those skilled in the art, potting traces 338 may includeusing materials such as plastics or silicone rubber gels tosubstantially insulate traces 338 from moisture, air contaminants, andother corrosive elements. Traces 338 formed from exposed copper may beconsidered to be a test pair, and potted traces 338 may effectively be acontrol pair used as a reference to which to compare the test pair. Theuse of a control pair and a test pair may enable better dataverification when signals associated with the control pair and the testpair are compared, as both the control pair and the test pair may beexposed to the same conditions. For example, the control pair and thetest pair may be exposed to substantially the same environment in termsof shock, vibration, and/or temperature. By exposing the control pairand the test pair to substantially the same environment, it maygenerally be easier to narrow the focus on effects of corrosion on thecontrol pair and the test pair, as the test pair may be corroded whilethe control pair remains substantially corrosion free.

Corrosion sensor assembly 312 also includes a gigabitserializer/deserializer (SerDes) component 342, a PIC microcontrollercomponent 346, a silicon storage technology (SST) flash memory component350, a temperature and/or humidity sensor 354, and an interfacecomponent 358, all of which may be coupled to or otherwise mounted onsensor PCB 330. In one embodiment, corrosion sensor assembly 312 mayinclude a battery component (not shown), e.g., a rechargeable battery,which allows corrosion sensor assembly 312 to continue to operate in theevent that the PCB to which corrosion sensor assembly is interfacedsuffers from a loss of power.

Gigabit SerDes component 342 enables communication between corrosionsensor assembly 312 and external management and monitoring logic, as forexample, software and/or hardware logic. Gigabit SerDes component 342may provide data to external management and monitoring logic, or amanagement arrangement, such that the external management and monitoringlogic may determine when to provide an alert, as for example to a systemoperator, that corrosion sensor assembly 312 is in a corrosiveenvironment.

PIC microcontroller component 346 is generally a controller which isconfigured to control the operation of corrosion sensor assembly 312. Inone embodiment, PIC microcontroller component 346 performs tasksincluding, but not limited to, identifying data logging intervals andobtaining the data, signal performance analysis, data analysis, andcommunications. In other words, PIC microcontroller component 346 maylog changes in signal integrity, and cause the changes to be analyzed,as for example using multi-variable data analytic trends andpredictions, to determine whether corrosion is likely occurring. PICmicrocontroller component 346 effectively interacts with trace pairs infield of traces 338, and derives data from quality and characteristicsof the signals flowing through the trace pairs. It should be appreciatedthat Gigabit SerDes component 342 may generally interact with field oftraces 338 to monitor changes, and pass information with respect to thechanges to PIC microcontroller component 346.

SST flash memory component 350 is generally configured to store obtaineddata. For example, SST flash memory component 350 stores non-volatiledata logged by corrosion sensor assembly 312 for substantially real-timeprocessing, and enables the logged non-volatile data to be retrieved. Itshould be appreciated that the retrieval of the non-volatile data fromSST flash memory component 350 may be performed substantiallyasynchronously. In addition, SST flash memory component 350 may alsostore externally derived data such as whether a host PCB has experienceda power loss.

Temperature and/or humidity sensor 354 is arranged to obtain localenvironmental data, and to provide the local environmental data forstorage in SST flash memory component 350 and analysis by PICmicrocontroller component 346. It should be appreciated that additionalsensors, e.g., a shock and vibration sensor, may also be included inpluggable corrosion sensor assembly 312.

Pluggable corrosion sensor assembly 312 may generally be of any suitablesize and shape. The size and shape of pluggable corrosion sensorassembly 312 may be selected based on the requirements of an overallsystem of which pluggable corrosion sensor assembly 312 is a part. Itshould be appreciated that, in general, components fixed to PCB 330 mayalso be protected from moisture and environmental degradation usingpotting techniques similar to those employed on control trace pairs, asmentioned above. FIG. 3B is a diagrammatic representation of pluggablecorrosion sensor assembly 312 in which pluggable corrosion sensorassembly 312 has a first shape in accordance with an embodiment. Apluggable corrosion sensor assembly 312 may be formed from PCB 330,which may be of any suitable thickness, e.g., a thickness ofapproximately 0.04 inches (in). As shown, traces 338 and openings 334are located on PCB 330 near an end of PCB 330. In the embodiment asshown, physical interface component 358 includes a latch feature 360arranged to allow physical interface component 358 to securely interfacewith a physical interface of a host system PCB (not shown). Physicalinterface component 358 may be plated in metal to allow for electricalconnectivity with a physical interface of a host system PCB.

Referring next to FIG. 4, a PCB assembly that includes a pluggablecorrosion sensor assembly of a first shape, as shown in FIG. 3B, will bedescribed in accordance with an embodiment. A PCB assembly 400 includesa main PCB 404, as for example a motherboard or a host system PCB, and apluggable corrosion sensor assembly 412. In general, PCB 404 includescomponents such as a connector 416, and may either have an onboard powersource or may be connected to an external power source (not shown).Connector 416 may be any suitable connector. By way of example,connector 416 may be a MicroSD connector.

In the described embodiment, connector 416 is configured to receive, orto engage with or connect to, at least a portion of pluggable corrosionsensor assembly 412 such that pluggable corrosion sensor assembly 412 iseffectively mounted substantially parallel to PCB 404, or substantiallyalong the same plane as PCB 404. As shown, connector 416 may be areceptacle configured to interface with or to engage with a physicalinterface component, e.g., a connector, of pluggable corrosion sensorassembly 412. That is, connector 416 is generally arranged to connectwith pluggable corrosion sensor assembly 412 to provide a mechanicaland/or electrical connection between PCB 404 and pluggable corrosionsensor assembly 412. Typically, at least a portion of pluggablecorrosion sensor assembly 412 is arranged to be inserted into connector416 such that pluggable corrosion sensor assembly 412 is removablycoupled to connector 416. Connector 416 may include retention componentsconfigured to interface with a latch feature or a protrusion included onpluggable corrosion sensor assembly 412. To reduce the likelihood ofcorrosion on connector 416, connector may include gold contacts arrangedto engage pluggable corrosion sensor assembly 412.

FIG. 5 is a process flow diagram which illustrates one method of using apluggable corrosion sensor assembly in accordance with an embodiment. Amethod 501 of using a pluggable corrosion sensor assembly begins at step505 in which a pluggable corrosion sensor assembly is inserted into areceptacle on a PCB. In one embodiment, inserting the pluggable sensorassembly into a receptacle on the PCB includes electromechanicallycoupling the pluggable sensor assembly with the PCB.

In step 509, the PCB assembly, i.e., the PCB with the pluggablecorrosion sensor, is placed in the environment to be monitored forpotential corrosion. That is, the equipment of which the PCB assembly isa part is placed in the environment to be monitored for potentialcorrosion. It should be appreciated that placing the PCB assembly in theenvironment to be monitored may generally include positioning the PCBassembly within the equipment. Sensor signals coming from the PCBassembly or, more specifically, from the pluggable corrosion sensorassembly are monitored in step 513. Monitoring sensor signals comingfrom the pluggable corrosion sensor assembly may include, but is notlimited to including, logging changes in the sensor signals, filteringthe changes, and analyzing the changes. The signals monitored mayinclude signals associated with test and control traces, as well assignals associated with a temperature and/or humidity sensor. In oneembodiment, the signals may be monitored by a management system whichobtains data from the pluggable corrosion sensor assembly.

A determination is made in step 517 as to whether the sensor signalsindicate potential corrosion. Such a determination may be based on anysuitable analysis. Analysis of test and control trace data may includefrequency and time domain comparisons. Monitoring differences or changesin signal quality may be performed through loss signatures orfrequency-dependent characteristics. However, other signal integrityartifacts such as, but not limited to, equalization needs of a receivermay be used as indicators of corrosion presence and severity on the testtraces. In general, signals associated with a test pair of traces on acorrosion sensor assembly and a control pair of traces on the corrosionsensor assembly may be compared to determine whether there is arelatively significant difference between the signals. When there is arelatively significant difference between the integrity of the signalsand/or when the difference between the signals increases over time, acorrosive environment may be indicated. In general, the more drastic thechange over time, the more server the environment that the equipment issubjected to. It should be appreciated that factors used to determinewhether corrosion is likely indicated may vary widely.

If it is determined that sensor signals do not indicate potentialcorrosion, process flow returns to step 513 in which sensor signals aremonitored. Alternatively, if potential corrosion is indicated in step517, process flow proceeds to optional step 519 in which it isdetermined whether the potential corrosion is at a level that warrantsremediation. That is, in one embodiment, it is determined in step 519whether a level of potential corrosion is over a threshold, e.g., athreshold over which remediation is performed. If it is determined thatpotential corrosion is not at a level that warrants remediation, thenprocess flow returns to step 513 in which sensor signals are monitored.Alternatively, if it is determined in step 519 that the potentialcorrosion level is over a threshold, process flow moves to step 521 inwhich a notification of potential corrosion may be provided, andremediation may be performed. In other words, when potential corrosionis indicated, a system operator may take actions to effectively ensurethat the PCB assembly is no longer subjected to the corrosiveenvironment upon receiving an indication of the potential corrosion. Forexample, the environment itself may be changed to reduce humidity,and/or the PCB assembly may be removed from the corrosive environment.In one embodiment, an indication of potential corrosion may be providedto a system operator in a notification from a management system, e.g.,logic or software, which obtains information from the pluggablecorrosion sensor assembly. It should be appreciated that if optionalstep 519 is not performed, when sensor signals indicate potentialcorrosion, process flow may proceed from step 517 substantially directlyto step 512.

Once remediation is performed in step 521, the pluggable corrosionsensor assembly may be optionally replaced in the PCB assembly.Replacing the pluggable corrosion sensor assembly with a substantiallynew pluggable corrosion sensor assembly facilitates the continuingmonitoring of the PCB assembly for potential corrosion. After thepluggable corrosion sensor assembly is optionally replaced, the methodof using a pluggable corrosion sensor assembly is completed.

A corrosion sensor assembly may generally be configured to determinewhether the corrosion sensor assembly is in a potentially corrosiveenvironment. In one embodiment, a corrosion sensor assembly may providedata to external management software, and the external managementsoftware may use the data to determine whether the corrosion sensorassembly is in a potentially corrosive environment and/or to effectivelyprovide a notification, as for example to a host operator, that thecorrosion sensor assembly has detected potential corrosion. FIG. 6 is adiagrammatic representation of an overall system that includes acorrosion sensor assembly and a computing system configured to processdata obtained by the corrosion sensor assembly in accordance with anembodiment. An overall system 680 includes a PCB assembly 600 and acomputing system 670. PCB assembly 600 includes a corrosion sensorassembly 612 that is arranged to provide data obtained by corrosionsensor assembly 612 to computing system 670. Management hardware and/orsoftware logic 674 executing on computing system 670 may process thedata obtained from corrosion sensor assembly 612 to provide anotification that PCB assembly 600 is potentially located in a corrosiveenvironment. Management logic 674 may trigger alarms if the dataobtained from corrosion sensor assembly 612 meets certain conditions,and may also be arranged to substantially predict the effect ofcorrosion on PCB assembly 600. In addition to implementing operatoralarms, management logic 674 may also be used to monitor temporalcorrosion data to create track corrosion presence and severity overtime, and to correlate data from multiple sensors to establish widercontextual information surrounding potential corrosion events.

Overall system 680 may combine and correlate corrosion sensor data withtemperature and humidity information from other site sensors. Further,system 680 may be used to assemble corrosion sensor data from multiplelocation, allowing system operators to discern spatial patterns, e.g.,in a data center installation.

Although only a few embodiments have been described in this disclosure,it should be understood that the disclosure may be embodied in manyother specific forms without departing from the spirit or the scope ofthe present disclosure. By way of example, electrical components of apluggable corrosion sensor assembly including, but not limited toincluding, a gigabit SerDes component, a microcontroller component, asensor, and a flash memory component may be potted to protect thecomponents from environmental damage.

A corrosion sensor assembly has been described as being arranged toprocess data to provide an indication of whether the corrosion sensorassembly is in a corrosive environment. In one embodiment, the corrosionsensor assembly may collect data, but rather than processing the data,the corrosion sensor assembly may provide the data to management logicexecuting on an external computing system, and the management logic mayprocess the data to determine whether the corrosion sensor assembly isin a corrosive environment.

The components included in a pluggable corrosion sensor assembly mayvary. For instance, while a pluggable corrosion sensor assembly has beendescribed as including a PIC microcontroller and an SST flash memory, itshould be understood that in lieu of a PIC microcontroller and/or an SSTflash memory, any suitable microcontroller or processor and/or anysuitable flash memory may be included on a pluggable corrosion sensorassembly.

A pluggable corrosion sensor assembly has been described as including aphysical interface component which allows the pluggable corrosion sensorassembly to be electrically and mechanically interfaced with a PCB,i.e., a PCB that is effectively to be monitored for the effects ofcorrosion. While a microSD connector has been described as being asuitable physical interface component, it should be appreciated that asuitable physical interface component for use to couple a pluggablecorrosion sensor assembly to a PCB may vary widely without departingfrom the spirit or the scope of the present disclosure.

In general, a pluggable corrosion sensor assembly has been described asbeing positioned on a PCB. While a pluggable corrosion sensor assemblyhas generally been shown as being oriented along the same plane as aPCB, e.g., such that the pluggable corrosion sensor assembly issubstantially parallel to the PCB, the orientation of the pluggablecorrosion sensor assembly with respect to the PCB may vary widely. Forexample, a pluggable corrosion sensor assembly may be interfaced with aPCB such that the pluggable corrosion sensor assembly is effectively ina substantially perpendicular orientation with respect to the PCB.

In one embodiment, a corrosion sensor assembly may be located in thevicinity of a PCB or piece of electrical equipment that is to bemonitored for corrosion. That is, in lieu of being located on a PCB orin a piece of electrical equipment that is to be monitored, a corrosionsensor assembly may instead be located in relatively close proximity tothe PCB or the piece of electrical equipment. For example, a corrosionsensor assembly may be affixed outside of an electrical equipmentenclosure, such as on a data rack.

The shape of a pluggable corrosion sensor assembly may vary widely. Itshould be appreciated that the shape of the pluggable corrosion sensorassembly as shown in FIGS. 3A and 4 is for purposes of illustration, andvarious other shapes are possible. In addition, the location of traces,openings, and/or components on the pluggable corrosion sensor may varywidely.

A PIC microcontroller may be equipped with analog to digital, anddigital to analog, conversion capabilities build in. As such, theability of a PIC microcontroller may be leveraged to send relativelyhigh frequency data directly through trace pairs on a corrosion sensorassembly and to receive that data substantially directly, beforedecoding the data and comparing the data. That is, a PIC microcontrollermay include some of the same capabilities as included in a GigabitSerDes.

The steps associated with the methods of the present disclosure may varywidely. Steps may be added, removed, altered, combined, and reorderedwithout departing from the spirit of the scope of the presentdisclosure. Therefore, the present examples are to be considered asillustrative and not restrictive, and the examples is not to be limitedto the details given herein, but may be modified within the scope of theappended claims.

What is claimed is:
 1. An apparatus comprising: a printed circuit board;at least one signal trace formed on the printed circuit board; a sensormounted on the printed circuit board and configured to receive signalsflowing through the at least one signal trace and collect data for usein identifying changes in the signals to indicate that the apparatus isin an environment that is corrosive based on the signals flowing throughthe at least one signal trace; and an interface coupled to the sensorfor transmitting the data or an indication that the apparatus is in theenvironment that is corrosive.
 2. The apparatus of claim 1, wherein theinterface is configured for transmitting the data to a computing systemoperable to process the data to determine if the apparatus is in acorrosive environment.
 3. The apparatus of claim 1, further comprising:a memory for storing the data; and a processor operable to process thedata received from the sensor, wherein the interface is configured totransmit the indication that the apparatus is in the environment that iscorrosive.
 4. The apparatus of claim 1, wherein the sensor is operableto monitor signal integrity of the at least one signal trace.
 5. Theapparatus of claim 1, wherein the at least one signal trace includes aplurality of signal traces and wherein the printed circuit boardcomprises a plurality of openings interspersed between the plurality ofsignal traces to allow air to flow around the plurality of signaltraces.
 6. The apparatus of claim 1, wherein the at least one signaltrace includes at least one test trace and at least one control traceand wherein identifying the changes in the signals to indicate that theapparatus is in the environment that is corrosive is based on a firstsignal from the at least one test trace and a second signal from the atleast one control trace.
 7. The apparatus of claim 1, further comprisinga temperature sensor.
 8. The apparatus of claim 1, further comprising ahumidity sensor.
 9. The apparatus of claim 1, wherein the at least onesignal trace includes a first pair of control traces shielded from theenvironment and a second pair of test traces exposed to the environment.10. A method comprising: monitoring a plurality of signals from aprinted circuit board (PCB) assembly coupled to a host PCB to determinewhether the plurality of signals are indicative of a potential corrosionon the PCB assembly, wherein the PCB assembly includes at least onesignal trace, wherein the plurality of signals are associated with theat least one signal trace; determining when the plurality of signalsindicate that the PCB assembly is in a corrosive environment; andproviding a notification that the PCB assembly is in the corrosiveenvironment based on determining that the plurality of signals indicatethat the PCB assembly is in the corrosive environment.
 11. The method ofclaim 10, wherein determining that the plurality of signals indicatethat the PCB assembly is in the corrosive environment includesdetermining that the at least one signal trace is corroded.
 12. Themethod of claim 11, wherein the PCB assembly is removably coupled to thehost PCB and arranged to be decoupled from the host PCB based ondetermining that the plurality of signals indicate that the PCB assemblyis in the corrosive environment.
 13. The method of claim 10, wherein theat least one signal trace includes a first pair of control tracesshielded from exposure to an environment and a second pair of testtraces exposed to the environment.
 14. The method of claim 10, whereindetermining when the plurality of signals indicate that the PCB assemblyis in the corrosive environment is based on a comparison of theplurality of signals with one another.
 15. The method of claim 10,wherein the at least one signal trace includes at least one controltrace and at least one test trace and the plurality of signals include afirst signal associated with the at least one control trace and a secondsignal associated with the at least one test trace.
 16. A sensorassembly comprising: a printed circuit; at least one signal trace formedon the printed circuit and having a plurality of signals flowingtherethrough; and a sensor, mounted on the printed circuit, thatreceives the plurality of signals flowing through the at least onesignal trace, wherein the sensor detects that the printed circuit is ina corrosive environment based on identifying changes in the plurality ofsignals.
 17. The sensor assembly of claim 16, wherein the at least onesignal trace is a plurality of control traces and a plurality of testtraces.
 18. The sensor assembly of claim 17, wherein the plurality ofcontrol traces are copper traces that are shielded from one or moreenvironmental factors and the plurality of test traces are exposed tothe one or more environmental factors.
 19. The sensor assembly of claim16, wherein the sensor is operable to monitor signal integrity of the atleast one signal trace.
 20. The sensor assembly of claim 16, wherein theat least one signal trace includes a plurality of signal traces andwherein the printed circuit has a plurality of openings interspersedbetween the plurality of signal traces to allow air to flow around theplurality of signal traces.